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> Training E-IPC-A-610E
Training E-IPC-A-610E
Acceptability of electronic assemblies mounted in through hole and pin-in-paste technology.
Purpos of training
  • The purpose of the training is to provide international guidelines contained in the  IPC-A-610E and IPC-J-STD-001E standards, in the field of eco electronic components assembly (through hole and surface) using lead-free and pin-in-paste technology. In the classes can participate people who every day deal with the assembly of eco electronic packages, as well as direct or indirect evaluation of their quality.

Duration

  • Duration of training: 4 days

Information about obtained certificates

  • certificate of participation in the training
  • IPC-A-610 CIS certificate
  • certificate of the Ministry of National Education

Possibility of participating in training

  • open trainings - cyclically organized in the RENEX headquarters in Wloclawek
  • closed trainings - organized for a specific customer (minimum group size 20 people)

Trainig topics

  • lead-free eco assembly technology - historical outline, reasons for use, benefits and problems associated with it
  • lead-free eco alassembly technology - review of the most commonly used solder binders
  • pin-in-paste technology - general rules of application and resulting from this ecological aspects
  • classification of electronic products and acceptability criteria for electronic connections
  • antistatic protection in modern electronics
  • mechanical assembly - general requirements and practical applications
  • general criteria for soldered connections; comparation of traditional and lead-free connections
  • an anomaly of soldering processes; characteristic features of lead-free connections
  • criteria for working with high voltage applications
  • practical classes consisting of evaluation of mechanical and soldered connections
  • basic information about the types of printed circuit boards (including lead-free)
  • requirements related to preparation of wires - insulation stripping methods and evaluation of wires, wire cores damages, birdcaging, tinning process
  • shaping principles and eco soldering of wires to turret, bifurcated, hook, cup terminals with mounting holes
  • practical classes consisting of evaluation of solder wire, including lead-free
  • general criteria for alignment and shaping of through hole components
  • criteria for alignment and soldering of through hole components in metallized and not metallized holes including use of pin-in-paste technology
  • use of connecting wires in through hole technology
  • practical classes consisting of evaluation of electronic packages containing through hole components and connecting wires
  • criteria for mounting of SMD components using glue
  • criteria for assembly and soldering of SMD components also using lead-free binders and pin-in-paste technology
  • use of connecting wires in surface mount technology
  • practical classes consisting of evaluation of electronic eco packages containing surface mount components and connecting wires
  • criteria for damage to electronic components
  • requirements for printed boards including: laminate state (point delamination, grid of small crack, pink ring, exposed fibers, fibres weave, depanelization, edge dissection), flexible and rigid-flexible connections, marks, solder mask, varnishing and sealing; boards made in lead-free technology
  • solderless wrap - general requirements and practical applications
  • practical classes consisting of evaluation of eco electronic packages containing through hole, surface mount components and connecting wires, assembled in lead-free and pin-in-paste technology

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